Modern Stencil Cleaning
Christoph Karl
» free «
Brief Insight
In the production of electronic assemblies, solder pastes and SMT adhesives are applied using stencils. Due to ongoing miniaturization and high component densities, fine-pitch stencils are increasingly used.
To ensure consistently high print quality, regular stencil cleaning is essential. It prevents quality losses in subsequent processes and minimizes risks associated with inadequate cleaning.
Delivery form: PDF
Article number: EN-2510-10
White paper
Modern Stencil Cleaning
Abstract
In the production of electronic PCBs, solder pastes and/or SMT adhesives are typically printed onto base sub-strates using stencils. Due to increasing miniaturisation and in order to achieve high packing densities, manufacturers very often use stencils with fine-pitch apertures. Regular cleaning of the stencils is essential for a satisfactory and reproducible print result.
This is the only way to prevent the subsequent production steps of assembly and soldering from being impaired in terms of quality assurance. The advantages of modern cleaning for the user, but also the risks and possible sources of faults that can occur with inadequate cleaning, will now be illustrated here.
Key Topics
-
Critical factors of stencil cleaning
-
Safetey through the use of modern cleaning media
-
Improved quality assurance thorugh automated stencil cleaning
-
Spraying systems or immersion systems with ultrasound
Category: PCB Production / Analytics | Request: Bookmark this
Christoph Karl
Project Engineer Applied Research, ZESTRON Europe
Christoph Karl studied Mechanical Engineering with a specialization in Materials Engineering, earning a Dipl.Ing. degree. He then worked at the University of Birmingham and in the automotive supply industry.
At Zestron, he is active in the Applied Research Group, where he oversees topics and research projects related to metrology, analytics, plant engineering, and Design of Experiment (DoE).
In the Applied Research Group, he collaborates with R&D and application technology to develop new methods for analyzing cleaning under components and presents results in a highly targeted manner.
